Service Introduction

If you are looking for IC packaging or IC testing services, tell us the packaging technology and specifications you need, Micro-ip will find the packaging/testing technology that suits your needs around the world.

Service Detail

SiP/SiM/ electrical / heat transfer / stress design analysis/fan out / WL_CSP / 2.5D, 3D stacking/ embedded component package/ ... and other process services


IC Assembly:ASE、SPIL、Powertech、JCET…etc IC Testing:ASE、KYEC…etc