TW / Global Website

Test and assembly Service

Service Detail

SiP/SiM/ electrical / heat transfer / stress design analysis/
fan out / WL_CSP / 2.5D, 3D stacking/ embedded component package/
...and other process services

Service Introduction

If you are looking for IC packaging or IC testing services, tell us the packaging technology and specifications you need, MicroIP will find the packaging/testing technology that suits your needs around the world.


Tong Hsing Electronic Industries
Phoenix Pioneer Technology