Company Profile
Company Profile

Company Profile

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MICROIP’s Market Position & Global Expansion Strategy

As a leading innovator in ASIC designservices and AI software solutions, MICROIP is committed to delivering high-performance, flexible IC design and AI-driven software platforms. The company is actively expanding its global reach through collaborations with international semiconductor and embedded technology enterprises.

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Our technical expertise also extends to the development of AI image application chips.

Driving Innovation in AI & ASIC Design.

MICROIP’s mission is to empower enterprises with next-generation chip design solutions that integrate AI, IoT, and custom semiconductor technologies. By leveraging cross-platform AI software and ASIC development expertise, the company helps customers overcome scalability, efficiency, and system integration challenges in the evolving semiconductor market.

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MILESTONE

2011 ~ Present
  • 2011
    • Founded in Republic of Seychelles
  • 2013
    • Filed 12 patent applications (5 Invention patents granted)
  • 2015
    • Launched product trading system
  • 2016
    • Launched outsource demand system
  • 2017
    • Launched Global Design Services System Won Bitcoin mining IC design services order
  • 2020
    • Completed design service projects with a renowned research institute and a leading ASIC design service provider
  • 2021
    • Established strategic partnerships with top-tier IP providers in the semiconductor industry
  • 2022
    • Signed a distribution agreement with Efinix
    • Secured an FPGA project with a leading global communications company
    • Won an IC design service contract with a top-tier semiconductor company
  • 2023
    • Successfully secured an NFC IC design service contract
  • 2024
    • Successfully listed on the Emerging Stock Board (Ticker: 7796)
    • AI software design services for WPG Holdings / MediaTek
    • Taiwan-Czech Semiconductor Program
    • Signed an MOU with HUFLIT (Ho Chi Minh City University of Foreign Languages and Information Technology) to promote semiconductor and AI development
  • 2025
    • Participated in CES 2025 in Las Vegas, USA
    • Exhibited at Embedded World 2025 in Nuremberg, Germany
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