MICROIP Unveils Breakthrough CAPS and CATS Solutions at Embedded World 2025, Tripling Business Opportunities Year-Over-Year

At Embedded World 2025 in Germany, MICROIP unveiled its groundbreaking CAPS (Cross-Platform AI Powered Solutions) and CATS (Custom ASIC Technology & Services), drawing significant attention from companies across Europe, the Americas, and Asia. During the exhibition, the company secured over 100 potential business leads—more than triple the number from last year—highlighting strong global demand for cross-platform AI software and ASIC design services.

Chairman Mr. Ken Yang emphasized, “Our CAPS technology enables seamless AI deployment across diverse domains such as AIoT, industrial automation, automotive systems, healthcare, smart cities, and consumer electronics. Meanwhile, our CATS ASIC design service delivers customized, efficient, and energy-saving chip solutions, helping clients significantly shorten product development cycles, reduce overall costs, and enhance market competitiveness.”

The CAPS platform featured multiple demos based on hardware solutions from MediaTek, Kneron, Xilinx, and Rockchip. With its advanced virtualization and middleware framework, CAPS enables efficient adaptation and integration of AI models across different hardware architectures, drastically reducing development and deployment time. For instance, MICROIP successfully integrated the MediaTek Genio 700 platform with CAPS, allowing 10 different AI applications to run simultaneously—clearly demonstrating CAPS' leadership in software-hardware integration.

The CATS custom ASIC design service addresses the growing demand in AIoT, industrial control, automotive electronics, and consumer electronics sectors. MICROIP offers comprehensive, one-stop solutions covering ASIC architecture consulting, custom design, AI accelerator development, and SoC integration. Leveraging its deep technical expertise and extensive experience in mature 28nm and 40nm chip design processes, MICROIP ensures customers receive high-performance, low-power, and stable ASIC solutions. These capabilities empower companies to significantly reduce development costs, manage power consumption effectively, and accelerate time-to-market.

In addition, MICROIP showcased the powerful iPROfiler tool from Arculus System, designed to help IC design teams effectively optimize AI SoC architecture—greatly shortening design, verification, and validation cycles.

Embedded World 2025 significantly enhanced MICROIP's international visibility and expanded its global partnerships. Taiwanese Ambassador to Germany, Dr. Shieh Chih-wei, personally visited MICROIP's booth, underscoring the Taiwanese government's strong support and recognition of innovation in advanced semiconductors and AI technologies.