About MICROIP Inc.

MICROIP Corporation was founded by Dr. James Yang in 2011, focusing on providing integrated circuit (IC) design services and chip performance analysis. MICROIP specializes in high-performance, low-power chip design, leveraging patented technologies to offer innovative, customized solutions for industries such as Artificial Intelligence (AI), Internet of Things (IoT), industrial automation, service robots, automotive electronics, and power management.


With an international R&D team and expertise in cross-disciplinary technology integration, MICROIP has rapidly risen in the semiconductor markets across the United States, Europe and Asia. The company has pioneered its unique “Designless” model, enabling clients to engage in customized chip design without requiring deep semiconductor knowledge, thereby lowering the barriers and resources needed for design.


MICROIP’s core services include:


Green IC Design Service: MICROIP offers comprehensive services for Application-Specific Integrated Circuit (ASIC) design, from concept planning to mass production. This includes chip performance analysis, power optimization, and process integration, helping clients create high-performance green chips that meet future demands. This service is widely applied in consumer electronics, industrial automation, long-term care, transportation, and the new energy industries.


Software Design Service: MICROIP’s AI software platform design services cover AI algorithm development, optimization, and deployment, offering clients AI solutions based on edge or endpoint computing. These services not only accelerate AI implementation but also ensure flexibility and scalability to adapt to rapidly evolving technologies.


Chiplet Design Service: With the rise of 3D packaging technology, MICROIP provides leading Chiplet design services, helping clients overcome the physical limitations of traditional 2D designs, enabling smaller chip sizes and enhanced performance. This technology is crucial for applications such as high-performance computing, data centers, and AI accelerators.


リーダーシップ

ジェームス・ヤン(GM)

マネジメント

経験
  • ライオニック社ハードウェア部長
  • ニューヨーク大学電気工学科研究員
学歴
  • ニューヨーク大学/博士号

ギャビン・リュー (副社長)

R&Dエンジニアリング

経験
  • ハードウェア技術者ライオニック株式会社 マネージャー
  • ハードウェア・アシスタント・マネージャー、Cion Tech.
  • ファラデーテック・シニアエンジニア
学歴
  • NYUST / BS EE

Liang Wu (CTO)

CTO and GM of IC Design

経験
  • Director, Design Engineering Center, Himax Technologies
  • Director of Design Engineering, M31 Technologies
学歴
  • NTHU / PhD

ロジャー・ワン(副社長)

セールス&マーケティング

経験
  • ARM社 シニア・セールス・ディレクター
  • マイクロソフト シニア・マネージャー
  • ブロードコム、リージョナル・セールス・マネージャー
  • インテル APACプロダクト・マーケティング・マネージャー
学歴
  • ボウイ州立大学 / MS MIS

ヘクター・チェン(CIO)

グローバル・インベストメント・センター

経験
  • 株式会社ラベンダーガーデンCEO
  • 台北富邦銀行・富邦生命マネジャー
  • MiTAC株式会社 MISプログラマー
学歴
  • CYCU / BS MATH

Ichin Cheng (FRSA)

Independent ESG Advisor

経験
  • Fellow of Royal Society of Arts (RSA)
  • Executive Director & Co-founder (Sustainable Innovation Lab)
  • Advisory board member of EU €80 billion R&D program Horizon 2020 Industrial Leadership (NMBP)
学歴
  • Visiting professor and guest lecturer to s universities in the EU and Asia.
  • Cambridge Univ.(Fellow of EMBA); John Hopkins Univ. (Master); NCCU(BA)

Prof. Martin Charter (FRSA)

Independent ESG Advisor

経験
  • Fellow of RSA & Clean Growth Leadership Network
  • Chair, Circular Economy Committee, BSI & Global chairman of ISO 14006 (Eco Design standard)
  • Member, Technical Advisory Committee of Engineering for a Sustainable Future (Institution of Electrical Engineers (IEE)
学歴
  • Director of The Centre of Sustainable Design, UCA
  • Professor, Innovation & Sustainability, UCA
  • MBA, Aston University